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  • Basic principium BGA Rework Statio

    Basic principium BGA Rework Statio

    Statio rework BGA est instrumentum professionalem ad partes BGA reparandas adhibita, quae in industria SMT saepe adhibetur.Deinde principale principium BGA stationis rework introducemus et factores clavium resolvere ad ratem BGA reparationem emendare debemus.BGA rework stationis optica dividi potest in co...
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  • What Do You need to know about Selective Wave Soldering?

    What Do You need to know about Selective Wave Soldering?

    Typi selectivi undae machinae solidandi selectivam undam solidandi in duo genera divisa sunt: ​​offline selectivam undam solidandi et online selectivam undam solidandi.Offline selectivam undam solidatorium: off-line means off-line with production line.Vexillum spargit machina et selectivam machi cucurbitulam ...
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  • Cur PCBA Board Deform?

    Cur PCBA Board Deform?

    In processu refluentis clibani et fluctuum machinae solidariae, PCB tabula deformis erit ob influentiam diversorum factorum, quae in pauperum PCBA glutino resultant.Simpliciter excutiemus causam deformationis PCBA tabulae.1. Temperature PCB tabulae transeuntis fornacis Singulae tabulae ambitus erunt...
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  • What Is The Difference between Selective Wave Soldering and Ordinary Wave Soldering?

    What Is The Difference between Selective Wave Soldering and Ordinary Wave Soldering?

    Unda machina solidatoria est totius circuli tabulae et superficiei contactu stanneo dependet a tensione solidae naturalis ascensus ad perficiendam glutino.Nam summus calor capacitas et multilayer tabulae ambitus, fluctus solidandi apparatus difficile est ad tin penetrationem requisita.Selectiv...
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  • What Is Offline AOI Machine?

    What Is Offline AOI Machine?

    Introductio Offline AOI Apparatus Offline AOI Deprehensio optica est nomen generale AOI post clibanum refluentem et AOI post apparatus fluctus solidandi.Post SMD partes ascenduntur vel solidantur in linea productionis superficialis PCBA, quae functiones capacitatis electronice capacitoris testium verticitatis ca...
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  • Influence Environment on Capacitor Performance

    Influence Environment on Capacitor Performance

    I. I. Ambiens temperatus 1. The high temperies The highest working environment temperies circa capacitorem magni momenti est pro applicatione eius.Temperatus Ortus omnes motus chemicos et electrochemicos accelerat, et materia dielectrica ad aetatem facilis est.Officium vitae th...
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  • What Are The Characteristics of Wave Soldering Machine Process?

    What Are The Characteristics of Wave Soldering Machine Process?

    1. Undo machinalis processus technologicus dispensatio → commissura → sanatio → unda solidatorium 2. Processus notarum Magnitudo et impletio solidi iuncturae dependet a consilio caudex et intermedium institutionis inter foramen et plumbum.Moles caloris applicati ad PCB dependet ma ...
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  • What Is Pick and Place Machine?

    What Is Pick and Place Machine?

    Quid est machina vagum et locum?Machina delige et locum est clavis et apparatus multiplex in productione SMT, quae in componentibus coniungendis magna celeritate et summa subtilitate adhibetur.Nunc machina vagus et locus elaboravit a prima humilitate celeritatis mechanicae SMT machinae ad centrum opticum altum celeritatem...
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  • What Are Factors Affecting The Quality of Solder Paste Printing?

    What Are Factors Affecting The Quality of Solder Paste Printing?

    1. Comprehendens crustulum excudendi genus machina rasoris solidatur: crustulum excudendi solidarium secundum characteres farinae aut glutinis rubri solidi ad eligendum congruum rasorium, maxime de rasorio amet factus est de ferro immaculato.2. Scraper angulus: angulus rasoris rasoris stannum crustulum, genera...
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  • What are the Causes of Solder Beading Producted During SMT Processing?

    What are the Causes of Solder Beading Producted During SMT Processing?

    Aliquando aliqui pauperes phaenomenon processus erunt in processu machinae SMT, plumbi plumbi unum ex illis est, ad problema solvendum, causam quaestionis primum cognoscere debemus.Prensatio solida est in crustulum LUSTRUM solidarium vel in processu premendi e caudex occurs.Per refluxus clibano sic...
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  • Quomodo uti Stencil Printer Manual?

    Quomodo uti Stencil Printer Manual?

    Typographus operandi processus farinae solidae manualis principaliter includit laminam, positionem, excudendi, accipiendo laminam et reticulum ferro purgandum.1. Secure rete chalybeum Utere figendi figendi rete chalybeum figere in machina typographica.Post taxationem, ut rete chalybs et PCB in f...
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  • Cautiones Using SMT Components

    Cautiones Using SMT Components

    Condiciones environmentales pro repositione partium collectae superficiei: 1. Temperatura ambiens: temperatura repono <40℃ 2. Productio situs temperatus <30℃ 3. Humiditas ambientium : <RH60% 4. Sphaera environmentalis: non toxici vapores ut sulphur, chlorinum et acidum. quae glutino pe... afficiunt.
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